Samsung is reportedly planning a major design change for its upcoming flagship Exynos 2700 chipset. The company could ditch the current layered design in favor of a new "side-by-side" (SBS) architecture, which is expected to address issues with overheating and slow data transfer.
The current Exynos 2600 uses Heat Path Block (HPB) technology for thermal management. However, in this chip, the RAM is placed directly on the processor (SoC) and the HPB heatsink is located on top of the memory. This can lead to heat trapping between the individual layers. The Exynos 2700 should eliminate this limitation by placing the RAM and the processor next to each other. The heatsink will then be placed above both components at the same time, allowing for more efficient heat dissipation from the power supply.
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Significant increase in memory throughput
In addition to improved cooling, the SBS arrangement will also bring benefits to memory performance. By shortening the physical distance between the RAM and the processor, Samsung aims to:
- Increase memory throughput by 30% to 40%.
- Launch applications faster.
- Smoother multitasking and better gaming experiences.
According to current information, the Exynos 2700 is expected to use Samsung's second-generation 2nm manufacturing process (SF2P) (Samsung's first 2nm mobile chip is the Exynos 2600). It will also offer a GAA (Gate-All-Around) transistor architecture. Production of the chipset is expected to begin in the second half of the year. 2026, with an official reveal expected later this year. The processor is likely to appear in select models of the series Galaxy S27 at the beginning of the year 2027.
